“Design Review and Preparation of Tools”:

Customer supplied data (Gerber) is used to produce the manufacturing data for the specific PCB.

We review the customer-supplied data (Gerber) to produce the manufacturing data. Once the inspection is completed, the data can be sent to the factory and the base material is cut to working panel sizes.

“Inner Layers Imaging”:

The process of transferring electronic data to the board surface using photosensitive dry-film and exposure to UV light.

> Pre-treatment -> Laminating -> Exposure -> Developing -> Etching -> Stripping

“AOI” (Automated Optical Inspection):

Inspection of the circuitry against digital images to verify that the circuitry matches the design and that it is free from defects.

“Lay-up and Bond (Lamination)”:

Under specific heat and pressure, the inner layer core, copper foil, and prepreg are bonded together.

Through this process, a solid and rigid stack up is formed.

“Drilling”:

Holes are drilled to facilitate electrical connections.

The clean and smooth drilled holes can enable quality copper plating of the holes and panels.

“Cu Plating”:

The chemical deposition of a very thin layer of copper on the hole wall. A conductive film is produced by chemical copper to create an electrical connection between the drilled holes and all layers.

“Outer Layer Imaging”:

Pre-treatment -> Laminating -> Exposure -> Developing -> Etching -> Stripping

“PSR (Photoimageable Solder Resist, Solder Mask)”:

Soldermask ink is applied over the whole PCB surface.

“Surface Treatment”:

Various finishes are applied to the exposed copper areas.

(e.g. HASL, LF-HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, etc.)

“Profiling”:

The process of machining the panels into specific sizes and shapes based upon the customer design.

Mainly available options when providing the array or selling panel are – v-scoring and routing.

“Electrical Test (BBT)”:

The process of checking the integrity of the tracks and the through-hole interconnections.

This process ensures that there are no open circuits or no short circuits on the finished board.

Test methods available: Universal & Flying Probe

“Final Inspection, Packing & Delivery, and After-sales Service”